1. Kev tshuaj xyuas zoo
Hauv kev tsim hluav taws xob, cov khoom siv hluav taws xob ncaj qha cuam tshuam rau kev ntseeg tau ntawm cov khoom siv hluav taws xob. Traditional inspection methods often struggle to detect solder defects hidden within the package. 3DX-ray inspection equipment can penetrate the package, clearly displaying the connection status of solder joints, including issues such as open solder joints, cold solder joints, and bridging. Tshwj xeeb tshaj yog rau cov hom pob xws li BGA (Ball Grid Array) thiab CSP (Chip Scale Package), 3D X- cov khoom siv hluav taws xob soj ntsuam tau dhau los yuav luag tsuas yog qhov ua tau tsis yog - txoj kev kuaj kev puas tsuaj.
2. Internal Structure Inspection ntawm Cheebtsam
Rau qee cov khoom tshwj xeeb, xws li semiconductor chips thiab kev sib xyaw ua ke, lawv cov qauv sab hauv yog qhov nyuaj thiab tsis tuaj yeem txiav txim los ntawm kev tshuaj xyuas qhov muag ib leeg . 3DX- cov khoom siv hluav taws xob soj ntsuam tuaj yeem nkag mus rau hauv pob ntawm cov khoom no, qhia lawv cov qauv pob hauv, kev sib txuas tus pin, thiab lwm yam, pab tshuaj xyuas cov khoom tsis tsim nyog thiab ua kom cov khoom ua tau zoo thiab ruaj khov.
3. Kev Tswj Xyuas Txheej Txheem Ntau Lawm
Ntawm cov khoom siv hluav taws xob tsim hluav taws xob, tiag- lub sijhawm teeb tsa ntawm 3D X- cov khoom siv hluav taws xob soj ntsuam tso cai rau qhov tseeb - lub sijhawm saib xyuas cov txheej txheem tsim khoom. Los ntawm kev txheeb xyuas cov teeb meem kev tsim khoom tam sim, xws li vuam qhov tsis xws luag thiab cov khoom tsis zoo, thiab kev hloov kho, kev tsim khoom thiab cov khoom zoo tuaj yeem txhim kho tau zoo.
4. Kev soj ntsuam ua tsis tiav
Thaum cov khoom siv hluav taws xob ua haujlwm tsis zoo, 3D X- cov khoom siv hluav taws xob soj ntsuam tuaj yeem ua qhov tsis yog - kev kuaj kev puas tsuaj. Los ntawm kev txheeb xyuas qhov tsis txaus ntseeg hauv cov qauv sab hauv, nws pab txheeb xyuas qhov ua rau tsis ua haujlwm thiab muab cov ntaub ntawv siv los txhim kho kev tsim thiab tsim cov txheej txheem. Qhov no yog qhov tseem ceeb rau kev txhim kho cov khoom lag luam kev ntseeg siab thiab txuas ntxiv lub neej kev pab cuam.
5. Kev soj ntsuam thiab kuaj cov khoom xa tuaj
Tom qab kev yuav khoom siab- kawg cov khoom, 3D X- cov khoom siv hluav taws xob soj ntsuam tuaj yeem siv rau tsis yog -kev tshuaj ntsuam xyuas kom paub tseeb tias cov qauv sab hauv puas tau raws li cov qauv. Qhov no pab ua kom zoo ntawm cov khoom siv raw thiab txo qhov tsis xws luag thaum lub sijhawm tsim khoom.
6. Thickness thiab Dimension ntsuas
Ntxiv rau kev txheeb xyuas qhov tsis xws luag, 3D X- cov khoom siv hluav taws xob soj ntsuam kuj tuaj yeem siv los ntsuas qhov tuab thiab qhov ntev ntawm crystalline silicon, cov khoom siv lead ua semiconductor, thiab lwm yam. Qhov no yog qhov tseem ceeb rau kev tswj cov khoom siv raw zoo thiab ua kom qhov tseeb ntawm cov txheej txheem ntau lawm.